Siemens unveils industrial metaverse technology, delivering true industrial intelligence, by bringing together physical AI ...

As organizations consider the synergy of digital twins and RTLS for factory optimization, having a clear understanding of ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

The simulation hypothesis—the idea that our universe might be an artificial construct running on some advanced alien computer—has long captured the public imagination. Yet most arguments about it rest ...

Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...