Abstract: As Moore's Law reaches its limit, the trend of chip development towards advanced packaging is becoming increasingly evident, with Chip on Wafer on Substrate (CoWoS) packaging (2.5D) ...
Enhancing Uniformity Detection in Woven Aeroengine Fan Blades Through Multiscale Feature Interaction
Abstract: Woven composite fan blades are renowned for their superior material properties and play a crucial role in the performance of aeroengines. During the manufacturing, the uniformity of fan ...
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