1. Gold-tin alloy (Au80Sn20): the ultimate solution in the field of high reliability. As the "king of performance" in the ...

Formic Acid Soldering Technology (FAST) products are designed for flux-free soldering, in particular, formic acid soldering. Product offerings include preforms, InFORMS and novel solder pastes, ...

Indium Corporation will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave ...

Ayyoun is a staff writer who loves all things gaming and tech. His journey into the realm of gaming began with a PlayStation 1 but he chose PC as his platform of choice. With over 6 years of ...

Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...

Indium Corporation will feature its high-reliability, gold (Au)-based precision die-attach (PDA) preforms for critical laser and radio frequency (RF) applications, as well as 5G communications, at the ...

AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...

This technology facilitates lower processing temperatures in preform soldering tasks. Developed for power module package-attach purposes, Indalloy 301-LT is a non-bismuth alloy that aims to prevent ...

Indium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany.

Indium Corporation is honored to announce that it has been awarded the Edward J. Pawenski Business/Industry Partnership Award by the New York Community College Trustees ... As one of the leading ...