Abstract: Wafer-Scale chiplet-based systems allow for condensing an entire data center rack into a single advanced substrate. However, power delivery and thermal management remain challenging. We ...
Abstract: As the number of I/O connections continues to increase, the Cu–Cu bonding technology has become a key enabler in advanced packaging technologies, necessitating precise extraction of contact ...
The next generation of high-bandwidth memory, HBM4, was widely expected to require hybrid bonding to unlock a 16-high memory ...
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