Abstract: TSV-based 3-D stacking enables large-capacity, power-efficient DRAMs with high bandwidth, such as specified by JEDEC's HBM standard. This article is a written version of Jun's very ...
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AMD Sapphire Nitro+ RX590 review - It's a cracking card!
Today amd launched their new RX590 - and it's actually a pretty good value for money proposition with this Sapphire Nitro+ ...
Abstract: Bandwidth Parts (BWPs) is a 5G NR feature introduced in 3GPP Release 15 for dynamically adapting the carrier bandwidth and numerology in which a UE operates. BWP allows supporting multiple ...
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