Provide practical KPIs to monitor, including FA hit rate (percent of FAs that find root cause) and time to address yield ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

Sid was born, did some stuff, then decided to become a writer. He finds respite in the sweet embrace of mass media escapism after having risked his life too many times as a journalist covering ...

The simulation hypothesis—the idea that our universe might be an artificial construct running on some advanced alien computer—has long captured the public imagination. Yet most arguments about it rest ...

Abstract: Direct wafer bonding technology is used in a growing number of semiconductor applications to meet device scaling challenges. Tight bonded wafer distortion requirements are needed to ensure ...