Find out CPO’s 2025 scorecard and what lies ahead for this optical interconnect technology in 2026 and beyond.

The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...

IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...

Although the AI didn't select the components or board layout, its assistance with routing potentially saved engineers weeks ...

Taoglas, a provider of advanced radio frequency (RF) and antenna solutions, has announced the expansion of its embedded ...

Addressing the core issues of latency and integration in developing audio amplifiers for today’s smart cockpits.

WENZHOU, ZHEJIANG, CHINA, January 5, 2026 /EINPresswire.com/ — The rapid advancement of the Internet of Things (IoT) has fundamentally altered the trajectory of residential and commercial lighting. As ...

MSI electrified CES 2026 with the debut of the long-awaited MEG X870E Unify-X Max motherboard—set to outshine the best ...

Radio frequency (RF) printed circuit boards represent one of the most demanding and technically challenging segments of ...

A structured design review process ensures alignment across teams.