Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...
A technical paper titled “Multi-tier Die Stacking Through Collective Die-to-Wafer Hybrid bonding” was published by researchers at imec, Brewer Science and SUSS MicroTec Lithography GmbH. “A collective ...
Multi-die system or chiplet-based technology is a big bet on high-performance chip design—and a complex challenge. In partnership withSynopsys To say that semiconductor technology is part of the ...
Synopsys IP and Certified EDA Design Reference Flow Speed Heterogeneous Integration on SF5/4/3 Nodes "Semiconductor designers are dealing with new levels of complexity as they develop high-performance ...
Certified digital and analog flows on the TSMC N2P and A16™ processes using TSMC NanoFlex™ architecture boost performance and speed analog design migration 3DIC Compiler platform and 3D-enabled IP ...
YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...
Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...
Explore insights into the accelerated shift toward multi-die systems in 2023. How different parts of the multi-die systems ecosystem are evolving. The adoption of muti-die architectures in various ...
The pressure to increase chip density has caused designers to leapfrog Moore’s Law and leverage other technologies beyond sheer feature size to address it. Since Gordon E. Moore, co-founder of Intel, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback