LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

Abstract: A critical review of the alignment factors contributing to the final die-to-target wafer overlay in a collective die to wafer bonding flow is presented and discussed in terms of minimal ...

In this video, I create a giant hula-themed cake inspired by an AI-generated design. The process includes translating the digital concept into a real cake through baking, shaping, and detailed ...

The rise of single-use electronics for fast health screening has prompted a reevaluation of traditional materials and manufacturing techniques to address the growing issue of electronic waste (e-waste ...

TOKYO - Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates. The new line will come online in January and is designed to support high ...