LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are being disrupted by ...

Moon Hyuk-soo, CEO of LG Innotek, met with reporters at CES 2025, the world's largest information technology (IT) and consumer electronics exhibition held in Las Vegas, USA, on the 8th (local time), ...

Phoenix Precision Technology, a Taiwan-based manufacturer of BGA (ball-grid array) substrate, has announced plans to allot approximately half of its substrate capacity for non-PC products. In the past ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

With Moon Hyuk-soo, CEO of LG Innotek, promoted to president in the 2026 regular executive reshuffle, LG Innotek is still struggling to bear fruit in new businesses. Unlike Samsung Electro-Mechanics, ...

Hsinchu, Taiwan-based semiconductor testing and assembly services provider ChipMOS Technologies Inc. has signed a one-year ball grid array (BGA) substrate supply agreement with Ryowa Co. Ltd., under ...

LG Innotek, the electronic components corporations of LG Group, is seeing profitability improve as shipments of high-value camera modules for Apple's "iPhone 17 series" increase, and expectations for ...