As organizations consider the synergy of digital twins and RTLS for factory optimization, having a clear understanding of ...

A research team affiliated with UNIST has reported a new simulation tool to better understand how liquid-phase chemical ...

Abstract: Ultrasonic wire bonding is one of the critical challenges for power semiconductor manufacturing process, especially for silicon carbide (SiC) power devices. Packaging-related strain on the ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...