Abstract: We propose a proof-of-concept augmented reality assembly tutorial application that uses a video-see-through headset to guide the user through assembly instruction steps. It is solely ...
Abstract: The advanced flip-chip-in-package (FCIP) process technology, using no-flow underfill material for high I/O density (over 3000 I/O) and fine-pitch (down to 150 mum) interconnect applications, ...
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