Abstract: This study conducts an in-depth finite element analysis of the structural performance of Thermoelectric Cooler (TEC) modules. By reasonably simplifying the model, a finite element model of ...

Abstract: With the increase of chip complexity, the design and production of substrates and chip tend to be "integrated", and ceramic substrates has been more and more widely used due to its ...

Shown is a graphical artist rendering of the Next Generation Air Dominance (NGAD) Platform, dubbed the F-47. (U.S. Air Force graphic) This year had its fair share of developments in air warfare, both ...

WASHINGTON/PARIS, Dec 19 (Reuters) - U.S. intelligence reports continue to warn that Russian President Vladimir Putin has not abandoned his aims of capturing all of Ukraine and reclaiming parts of ...