Sustainable packaging innovator Notpla returns to its roots as Imperial College London adopts seaweed-based alternatives to ...
Abstract: 2.5D packaging supports high-speed data transmission, meeting performance requirements of GPU. However, signal integrity (SI) is a key challenge to packaging. This paper demonstrates a GPU ...
Abstract: Copper-filled via is a critical component of advanced electronic packaging technologies. Embedded in interposer substrate, vias provide enhanced electrical performance in 2.5-D and 3-D ...
According to South Korean technology outlet ZDNet Korea, SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South ...
TSMC Co-COO Y.J. Mii wins Executive Yuan Award for driving advanced process and packaging innovation
TSMC Executive Vice President and Co-Chief Operating Officer Y.J. Mii has been awarded the Executive Yuan Award for Outstanding Science and Technology Contribution, underscoring both his personal ...
Lyre’s Non-Alcoholic Spirits announced the launch of its new packaging design and rebrand, set to debut globally on eCommerce in Q4 2025, rolling out in select markets in early 2026. The refreshed ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback