Abstract: In this paper, we propose a novel post-bond through-silicon via (TSV) test method for post-bond TSV manufacture test. The proposed method can measure the RGC parameters of TSVs using ...

Youden's test is a reliable method to evaluate the robustness of analytical methods, by means of an experiment design which involves seven analytical parameters combined in eight tests. In the present ...

Abstract: An inappropriate installation location of a target on a turntable in scattering measurements causes inessential radar cross section (RCS) fluctuations, which increases the miss-detection ...

Self taught software engineer going all the way from working as a seller in Nike to Senior Engineer at Apple. Self taught software engineer going all the way from working as a seller in Nike to Senior ...

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