I have never liked to hear the colloquial word “chips” as a shorthand term for integrated circuits, except when it is used between engineers who actually know what an IC really is. When it is used by ...

(Bloomberg) -- A secretive American startup has emerged with aspirations to challenge two titans of the semiconductor industry: ASML Holding NV and Taiwan Semiconductor Manufacturing Co. The company, ...

Join the event trusted by enterprise leaders for nearly two decades. VB Transform brings together the people building real enterprise AI strategy. Learn more Intel said it has made a significant ...

Intel has provided more details about the glass substrate at its annual event while promising to deliver 1 trillion transistors in a package by 2030. At the “Intel Innovation” event in San Jose, ...

Chip and substrate fabrication might not be the most exciting topic in the world, but when it could lead to significant performance and efficiency improvements, you'd better bet I'm here for it. So, I ...

Welcome to Tech In Depth, our daily newsletter about the business of tech from Bloomberg’s journalists around the world. Today, Ed Ludlow and Ian King report on the skepticism that has greeted startup ...

In a nutshell: TSMC is venturing into uncharted territory with a novel approach to advanced chip packaging. The chipmaker reportedly plans to switch from conventional round wafers to rectangular ...

South Korean giants Samsung Electronics and SK Group are "speeding up efforts" to secure future dominance in glass substrates, which would be a "game-changer" for the semiconductor and AI industries.

In context: Manufacturers are trying to develop novel chip substrate technologies to save Moore's law and keep crunching the Megahertz rates up. Glass is the most promising material for next-gen ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...