July 25 (Reuters) - China Wafer Level CSP Co Ltd : * SAYS IT PLANS TO INVEST 200 MILLION YUAN ($29.50 million) TO SET UP INTEGRATED CIRCUIT INDUSTRY FUND WORTH 606.0 MILLION YUAN Source text in ...
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing... China's homegrown ...
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