X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Tombstoning is a defect where a two-leaded, wrap-around lead-style termination chip component fails to lay down appropriately and allow solder to simultaneously make a required electrical/mechanical ...

Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...