Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

Hungry individuals don't put much thought into the packaging of their food. When people grab a snack, they generally rip into ...

Advanced packaging is rapidly becoming a mainstream option for chipmakers as the cost of integrating heterogeneous components on a single die continues to rise. Despite several years of buzz around ...

RIT’s packaging science program recently received an equipment donation for its Packaging Dynamics Laboratory that will increase its academic and professional training options in safe-guarding shipped ...

Following a successful Virtual Engineering Week event, which took place November 30 – December 4, 2020, Virtual Engineering Days is the second digital event offered ahead of the upcoming Informa ...