Co-packaged optics (CPO) technology can integrate photonic integrated circuits (PICs) with electronic integrated circuits (EICs) like CPUs and GPUs on a single platform. This advanced technology has ...

Comprised of judiciously engineered microscopic photonic structures with subwavelength features, the concept of metasurface and metamaterials have proven fruitful results in the realm of meta-optics.

Researchers have now developed a new superior hardware platform for artificial intelligence accelerators using photonic integrated circuits on silicon chip. Co-packaged optics (CPO) technology can ...