Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers December 17, 2025 -- TOPPAN Inc.

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

Samsung Electro-Mechanics and LG Innotek are accelerating their AI semiconductor substrate businesses. Samsung Electro-Mechanics recently started operating its Vietnam flip chip-ball grid array ...

Phoenix Precision Technology, a Taiwan-based manufacturer of BGA (ball-grid array) substrate, has announced plans to allot approximately half of its substrate capacity for non-PC products. In the past ...

Moon Hyuk-soo, CEO of LG Innotek, met with reporters at CES 2025, the world's largest information technology (IT) and consumer electronics exhibition held in Las Vegas, USA, on the 8th (local time), ...

CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are being disrupted by ...

LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor substrate targeting tech firms in the United States. “We have begun mass production of FC-BGA for ...

Semiconductor glass substrates are drawing attention as a key material that can solve problems in the packaging domain, which has hit technical limits in the age of artificial intelligence (AI). Major ...

Hsinchu, Taiwan-based semiconductor testing and assembly services provider ChipMOS Technologies Inc. has signed a one-year ball grid array (BGA) substrate supply agreement with Ryowa Co. Ltd., under ...