Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The ...
The floodgates for chiplet-based design have officially opened. Over the past several quarters, manufacturing test flows have been validating 2.5D package architectures, and production volumes are ...
Powering precision: why the future of high-power test benches must be fully integrated and automated
The global test and measurement (T&M) market is expanding from $34.11 billion in 2024 to an estimated $43.95 billion by 2030.
System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...
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